IMAPS - International Microelectronics and Packaging Society
IMAPS - Mission/Purpose
The International Microelectronics and Packaging Society is the largest society dedicsted to the advancement and growth of microelectronics and electronics packaging. IMAPS leads the Microelectronics Packing, Interconnect and Assembly Cimmunity, providing means of communicating, educating, and interacting at all levels. Our Society offers chapters around the globe, creating global networks of more than 4,000 members in the United States and an additional 4,000 members throughout Europe and Asia.
Club Officers 2012-2013
| President: Buddy Bump |
Materials Engineering | bbump@calpoly.edu |
| Vice-President: Vincent Khougaz |
Industrial Engineering | vkhougaz@calpoly.edu |
Faculty Advisor
John Pan, Ph.D. Industrial & Manufacturing pan@calpoly.edu
The Team:
