Phone Number: 805-756-2540
Email: pan(place an 'at' sign here)calpoly.edu
B.E., Xidian University
M.S., Tsinghua University
Ph.D., Lehigh University
Lead-free Soldering and Reliability
Materials, Thermal Management, Reliability of Electronic Packaging
Areas of Interst and Expertise: Materials and processes of microelectronics packaging, wearable electronics, solder joints and electronic interconnections, LED packaging, quality and reliability, design of experiments, applied statistics.